The candidate will be responsible for physical failure analysis of packaged/un-packaged semiconductor product or test chip material employing results to establish root cause. You will assist engineering in assessment of process health and defect identification.
Owns Transmission Electron Microscopy (TEM) prep and/or hands-on physical analysis, including sample preparation for probing or TEM imaging. Assignments are semi-routine in nature but require a wide array of laboratory techniques and skills. Judgment required to resolve nonstandard problems. Normally receives general instructions on work from engineers. This is an entry level position and will be compensated accordingly.
-Organizing work to ensure accomplishment of associated tasks including analysis, documentation and follow through.
-Work from technical documents, design layout, written Best Knowledge Methodologies (BKM) and/or verbal directions to complete tasks in assigned areas.
-Maintain necessary records and reports. Perform other related duties as required or as directed.
The successful candidate will be expected to master TEM prep and/or de-layering/de-processing techniques including but not limited to polishing, dimpling, CNC milling, wet and dry etch, Focus Ion Beam FIB assisted depositions and milling, SEM inspection, TEM prep and other PFA techniques to facilitate FA on the latest semiconductor processes. Candidates with the right background and basic electron microscopy skills will be trained as required in all necessary competencies.
The ideal candidate should exhibit the following behavioral traits:
Attention to detail, focus to execute and willingness to learn new techniques is essential
You must possess the below minimum qualifications to be initially considered for this position. Relevant experience can be obtained through school work, classes and project work, internships, military training, and/or work experience.
Candidate must have an Associate or Bachelor’s degree in Electron Microscopy, Materials Science, Physics, Chemical Engineering, Electrical Engineering, Chemistry, related field or military experience.
Must have unrestricted-permanent right to work in US without requiring sponsorship.
Hands on electron microscopy experience and Knowledge of IC processing and de-processing or analytical laboratory techniques and tools used to identify Si process defect at different processing layers, from package to transistor.
Understanding of wet and dry etching, mechanical grinding, polishing, and dimpling is helpful.Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth
Posting Statement. Intel prohibits discrimination based on race, color, religion, gender, national origin, age, disability, veteran status, marital status, pregnancy, gender expression or identity, sexual orientation or any other legally protected status.
Click here for more info: http://jobs.intel.com/ShowJob/Id/1470539/Failure-Analysis-Engineer-Technician/
• Post ID: 25829962 portland